YINCAE SMT256 SERIES DIP ADHESIVES COLORLESS OR YELLOWISH,30CC-SYR
One Part/Solder Protective Material/Replace under fill material
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Description
YINCAE SMT256 Series Application description： A device that requires a specification reliability such as BGA FLIPCHIP.
Additional information
| Brand | YINCAE |
|---|---|
| Application | Die Adhesive |
| Market application | Semiconductor |
| Mix Ratio by Weight | One Part |
| Material | EPOXY |
| Color/Appearance | Colorless, Yellowish |
| Viscosity (mPa.s) | 5,000-20,000 |
| Cure Condition | Reflow Process (140℃~260℃) |
| Working Time (@25℃) | N/A |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
