SIL-MORE EOX-BAB-EM2R50
5:1/Thermal conductive potting /Low curing shrinkage
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Additional information
| Brand | SIL-MORE |
|---|---|
| Application | Encapsulants / Potting |
| Market application | Automotive Electronics, Consumer Electronics, General Industry |
| Mix Ratio by Weight | 5:1 |
| Material | EPOXY |
| Color/Appearance | Black |
| Viscosity (mPa.s) | 7,500 ~ 8,500 |
| Working Time (@25℃) | 60 mins |
| Cure Condition | ≦12 hrs @ 25℃, ≦5 hrs @ 50℃ |
| Certification | UL 94 V-0 |
| Specific Gravity | 2 |
| Hardness (Shore) | 86 (D) |
| Glass Transition Temperature | 2.5(Thermal Conductivity (W/m∙k) |
| Dielectric Strength (KV/mm ) | ≧10 |
| Volume Resistivity (ohm*cm) | > 1013 |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
